TUSB8020B-typical-application

Datasheet

Schematic

Layout Guidelines

Placement

  1. A 9.53-kΩ ±1% resistor connected to terminal USB_R1 should be placed as close as possible to the TUSB8020B.
  2. A 0.1-µF capacitor should be placed as close as possible on each VDD and VDD33 power pin.
  3. The 100-nF capacitors on the SSTXP and SSTXM nets should be placed close to the USB connector (type A, type B, and so forth).
  4. The ESD and EMI protection devices (if used) should also be placed as possible to the USB connector.
  5. If a crystal is used, it must be placed as close as possible to the TUSB8020B device’s XI and XO terminals.
  6. Place voltage regulators as far away as possible from the TUSB8020B, crystal, and differential pairs.
  7. In general, the large bulk capacitors associated with each power rail should be placed as close as possible to the voltage regulators.

I2C Programming

  • OTP: non-volatile memory
  • Address:
    • 0x44
    • 0x4C